Rising Star on 2020 CIOE:  minisilicon shows off the high bandwidth portfolio products on PON and Datacenter application

Release date:
2021-08-27
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ICC News September 9-11, 2020, during the CIOE China Optical Expo, the optical fiber communication industry chain gathered together, and domestic and foreign manufacturers displayed their advanced products and solutions. Under the trend of localization of optical communication, many Chinese optical communication device and chip representative enterprises have launched many advanced products. The chips have been successfully sampled and are under research, and are committed to building the backbone of domestic chips.

Mixin Technology's high-speed products appear at the China Optical Expo to create the backbone of do

  According to Xunshi, minisilicon was established in Hangzhou in 2017, and has R&D and design teams in Zhangjiang, Shanghai and Silicon Valley in the United States. Just over two years after its establishment, minisilicon has launched a variety of excellent high-speed optical transceiver chips, and its product portfolio was unveiled at the Optical Expo, and it has cooperated with the optical communication industry chain and customers to carry out exchanges and cooperation.

  minisilicon General Manager Dr. Luo Gang said to Xunshi that minisilicon is a group of returned chip design experts, local market operations, and back-end engineers. The core management team members focus on the fields of optical communication chips and data communication chips. They have more than 20 years of R&D and design experience, are familiar with various special processes, have rich experience in market applications, and have a wealth of network resources. There is a deep understanding of the industry chain.

Mixin Technology's high-speed products appear at the China Optical Expo to create the backbone of do

  Currently, the optical communication industry chain is undergoing localization upgrades to complement the shortcomings of optical communication chips. Facing the optical fiber communication market, minisilicon successfully launched chip products such as TIA/LA/CDR/Driver for the three major application areas of PON optical access network, data center and 5G fronthaul. Some products have withstood the test of optical communication customers and achieved high standards. Evaluation.

  In the field of PON optical access network, minisilicon has launched a variety of central office and client optical module electrical chip products. The central office products include four products including burst receiving 10G EPON TIA/LA chip and XGS-PON TIA/LA chip. At the same time, the company is developing an EML Driver (with CDR) chip, which is expected to be formally sampled in December this year. For ONU end applications, minisilicon has launched a 10G APD TIA chip, which has excellent anti-Wifi and sensitivity performance, and has a smaller volume than similar products. In this segment, it is leading the international similar products on the market. Advanced chip.

Mixin Technology's high-speed products appear at the China Optical Expo to create the backbone of do

In the data center field, minisilicon has launched a product portfolio covering 5 chips, three of which are single-channel multi-mode transceiver combo (integrated with 2 CDRs) TIA+Driver, and transmitter Vcsel Driver (integrated with a CDR) And the receiving end TIA (integrated with a CDR), all three chips have been tested and verified by customers. In terms of higher speed 100G, the 4x25G TIA product developed by minisilicon is in the testing process and can be provided as samples to customers for testing. At present, samples have been sent to major optical module manufacturers such as Hisense, Accelink, and Huagong. Another product is a single-channel 112G PAM4 TIA. After several customer tests, the response performance is excellent. The four-way 112G PAM4 TIA has been handed over to Foundry for tape-out, and it is expected that the sample reflow will be completed in December.

  In the field of 5G fronthaul, minisilicon provides 25G TIA and 25G DML optical module Combo chips (including CDR). Among them, 25G TIA has completed sampling, and 25G DML optical module Combo chips will also start sampling in October.

Mixin Technology's high-speed products appear at the China Optical Expo to create the backbone of do

 At this optical expo, minisilicon also displayed its MCU products, the purpose is to provide customers with a complete 10G optical module IC product service. 2020 is the stage of sample delivery and conversion of many products of minisilicon. So far, some customer orders have been received. Will bring significant improvement to the company's industry.

  With the development of new infrastructure such as 5G and data centers, and the continuous upgrade of 10G PON, it is expected that next year will usher in an explosive market situation. Relying on market opportunities, minisilicon will strive to become a diversified and comprehensive product supplier in the field of optical communication applications and become the backbone of domestic chips.

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