Development History

minisilicon members have academic qualifications in the United States, the United Kingdom, Singapore, etc., and have long been designing advanced chips for cutting-edge applications in multinational companies. Now they are committed to China's innovative communications fields.

2017
minisilicon Was Established

November: Hangzhou minisilicon Technology Company was registered and established

2018
Shanghai R&D Center Established

March: Shanghai R&D Center was established

September: The company's first chip 10GEPON/XGSPON burst-limiting amplifier was successfully taped out

2019
Shanghai Company Was Established And Scaled up

March: 10GEPON/XGSPON burst-limiting amplifier successfully passed the third-party test

September: 28G/100G datacenter transceiver with CDR combo chip successfully taped out

December: Zhangjiang Office of Shanghai R&D Center expanded

2020
Chengdu Subsidiary Established

February: Shanghai minisilicon Technology Co., Ltd. was registered, and the company headquarters was transferred to Shanghai

March: 5G fronthaul chipset successfully taped out

July: Chengdu company was established

2021
The Company Enters a New Stage

March: 10G TIA and 56G PAM4 TIA chips were successfully mass-produced

August: The company completes the A round of financing and enters a new stage