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About Us
Development History
minisilicon members have academic qualifications in the United States, the United Kingdom, Singapore, etc., and have long been designing advanced chips for cutting-edge applications in multinational companies. Now they are committed to China's innovative communications fields.
November: Hangzhou minisilicon Technology Company was registered and established
March: Shanghai R&D Center was established
September: The company's first chip 10GEPON/XGSPON burst-limiting amplifier was successfully taped out
March: 10GEPON/XGSPON burst-limiting amplifier successfully passed the third-party test
September: 28G/100G datacenter transceiver with CDR combo chip successfully taped out
December: Zhangjiang Office of Shanghai R&D Center expanded
February: Shanghai minisilicon Technology Co., Ltd. was registered, and the company headquarters was transferred to Shanghai
March: 5G fronthaul chipset successfully taped out
July: Chengdu company was established
March: 10G TIA and 56G PAM4 TIA chips were successfully mass-produced
August: The company completes the A round of financing and enters a new stage