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Company Profile
Established in 2017, minisilicon is a leading mixed-signal and timing product company, which supports a large portfolio of electronic components for optical communications.
Development History
800G&1.6T LPO/ACC/AEC pre-designEIC+PIC co-package design
400G LPO/ACC/AEC design kick-off
400G PAM4 CDR revision design
50G-PON Co-R&D with network solution provider
400G TIA customer design in
Domestic 10G OLT major supplier
XG-PON customer verification，
4*100G TIA customers verification，
10G ONU Driver+CDR Tape-out
10G ONU TIA market share up to 40%，
Released MCU msMx0xx series for Optical Tranceivers
XGS-PON mass production
10G ER/ZR CDR+Driver design-win multi customers
25G/100G datacom customer verification
Kick-off 4x100G CDR+Driver and CDR+TIA
10G OLT TRx chips were mass-produced, 100G DC was introduced
10G TIA chips were mass-produced, 10G Super TIA was taped out
200G PAM4 CDR was taped out
A+ round of financing was completed
The company completes the A round of financing and enters a new stage
10G TIA and 56G PAM4 TIA chips were successfully mass-produced
Chengdu company was established
5G fronthaul chipset was successfully taped out
Shanghai minisilicon Technology Co., Ltd. was registered
Zhangjiang Office of Shanghai R&D Center Expands
28G/100G datacenter transceiver with CDR combo chip was successfully taped out
10GEPON/XGSPON burst-limiting amplifier successfully passed the third-party test
The company's first chip 10GEPON/XGSPON burst-limiting amplifier was successfully taped out
Shanghai R&D center established
Hangzhou minisilicon technology company was registered
With a rapid growth of silicon photonics application, LiDar and in-vehicle fiber-optic communications, the future market is promising
Explore the new era of light
Intelligence, inspiration
innovation, integrity
R&D Centers
7th Floor, Building 4, No. 388 Shengrong Road, Pudong District, Shanghai
Room 1301, 13th Floor, Building 1, No. 380 Jiangnan Avenue, Binjiang District, Hangzhou
No. 508, Building 5, Tian Fu Xin Gu, No.399, Fucheng Avenue, Wuhou District, Chengdu
minisilicon has a mature high-tech team of overseas returnees, in which includes professionals with more than 20 years experience in optical communication. Technical expertise includes optical communication module chip design, high-speed transceivers, high-performance and low-noise frequency synthesizer, and high-speed SerDes PHY, etc.
Formerly appointed Design Director-Microchip，Design Director-Micrel，Chief Engineer-Oxford Semi
Formerly appointed Chief Designer-Cadence，Chief Analog Designer-LSI，Senior IC Designer-XILINX
Formerly appointed Chief Designer-Microchip，Senior Analog Designer-Micrel Inc，Senior Analog Designer-Phaselink
Formerly appointed Supply Chain Manager-Semtech，Global Supply Chain Manager-eSilicon，Program Manager-Verisilicon
Formerly appointed Digital IC Design Engineer-C*Core Technologies，Digital IC Design Engineer-Silan Microelectronics，Analog IC Design Engineer-Silan Opto
Senior Engineer-Realtek
Qualifications
Participate in essential project
minisilicon is responsible for the core electrical chip development in “Photonic Technology” project 1.8
By 2022, minisilicon has achieved the financing of round A+