minisilicon - minisilicon

Company Profile

Established in 2017, minisilicon is a leading mixed-signal and timing product company, which supports a large portfolio of electronic components for optical communications.

Development History

2023

2022

2021

2020

2019

2018

2017

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2023.11

XG-PON customer verification，

4*100G TIA customers verification，

10G ONU Driver+CDR Tape-out

2023.10

10G ONU TIA market share up to 40%，

Released MCU msMx0xx series for Optical Tranceivers

2023.9

XGS-PON mass production

2023.8

10G ER/ZR CDR+Driver design-win multi customers

2023.7

25G/100G datacom customer verification

2023.1

Kick-off 4x100G CDR+Driver and CDR+TIA

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2022.11

10G OLT TRx chips were mass-produced, 100G DC was introduced

2022.09

10G TIA chips were mass-produced, 10G Super TIA was taped out

2022.07

200G PAM4 CDR was taped out

2022.05

A+ round of financing was completed

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2021.08

The company completes the A round of financing and enters a new stage

2021.03

10G TIA and 56G PAM4 TIA chips were successfully mass-produced

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2020.07

Chengdu company was established

2020.03

5G fronthaul chipset was successfully taped out

2020.02

Shanghai minisilicon Technology Co., Ltd. was registered

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2019.12

Zhangjiang Office of Shanghai R&D Center Expands

2019.09

28G/100G datacenter transceiver with CDR combo chip was successfully taped out

2019.03

10GEPON/XGSPON burst-limiting amplifier successfully passed the third-party test

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2018.09

The company's first chip 10GEPON/XGSPON burst-limiting amplifier was successfully taped out

2018.03

Shanghai R&D center established

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2017.11

Hangzhou minisilicon technology company was registered

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Future Prospects

With a rapid growth of silicon photonics application, LiDar and in-vehicle fiber-optic communications, the future market is promising

Silicon Photonics

LiDar

in-vehicle fiber-optic communications

Vision and values

Vision & Value

Explore the new era of light

Intelligence, inspiration

innovation, integrity

R&D Centers

研发中心

Minisilicon Shanghai

7th Floor, Building 4, No. 388 Shengrong Road, Pudong District, Shanghai

Minisilicon Hangzhou

T8-905, The Starry Center, Binjiang District, Hangzhou

Minisilicon Chengdu

No. 508, Building 5, Tian Fu Xin Gu, No.399, Fucheng Avenue, Wuhou District, Chengdu

Technical teams

技术团队

minisilicon has a mature high-tech team of overseas returnees, in which includes professionals with more than 20 years experience in optical communication. Technical expertise includes optical communication module chip design, high-speed transceivers, high-performance and low-noise frequency synthesizer, and high-speed SerDes PHY, etc.

Raymond Luo

CEO

Formerly appointed Design Director-Microchip，Design Director-Micrel，Chief Engineer-Oxford Semi

Richard Li

Analog Design Director

Formerly appointed Chief Designer-Cadence，Chief Analog Designer-LSI，Senior IC Designer-XILINX

XiaoLan Song

Analog Design Director

Formerly appointed Chief Designer-Microchip，Senior Analog Designer-Micrel Inc，Senior Analog Designer-Phaselink

Shania Li

Operation Director

Formerly appointed Supply Chain Manager-Semtech，Global Supply Chain Manager-eSilicon，Program Manager-Verisilicon

Kelly Zhan

Design Director

Formerly appointed Digital IC Design Engineer-C*Core Technologies，Digital IC Design Engineer-Silan Microelectronics，Analog IC Design Engineer-Silan Opto