With the rapid promotion and popularization of emerging technologies such as cloud computing, the Internet of Things, artificial intelligence, and 5G, the human society in the future will evolve into a society in which all things perceive, all things are interconnected, and all things are intelligent. Based on its own technical research and development strength and market application needs, minisilicon focuses on mid-to-high-end optical module electrical chip products, and provides mid-to-high-speed, self-developed electrical chips for multiple high-growth application industries (PON/ 5G/data center) terminal products to meet the market demand of large bandwidth, low latency, wide connection, high security, better stability and high efficiency.

4G/5G Network
4G/5G Network
Datacenter
Datacenter
FTTx-PON
FTTx-PON

PN

Type

DataRate

Application

Supply

Voltage(V)

Channels

Power Consumption(mW)

Package&Size

Burst Mode LA

1.25&10.3125Gbps

10GEPON OLT
3.3

1

303.6

QFN & 4mm x 4mm 

DML Driver+CDR+LA

8.5~28.1Gbps

25G LR
3.3

1

800

eWLB & 4.65mm x 4.65mm

TIA

28Gbps

25G LR
3.3

1

90

Die & 0.9mmx0.9mm

TIA

100Gbps

100G LR4
3.3

4

270

Die & 0.9mmx0.9mm

TIA

28GBaud

56G LR
3.3

1

198

Die & 1.5mmx0.7mm

TIA

56GBaud

400G DR4
3.3

4

792

Die & 3.2mmx1.1mm

TIA

56GBaud

100G LR
3.3

1

198

Die & 1.5mmx0.7mm

VCSEL Driver+CDR

28GBaud

200G SR4
3.3

4

1379

Die & 4.1mm x 3.1mm

CDR+TIA

28GBaud

200G SR4
3.3

4

1510

Die & 4.1mm x 3.1mm 

TIA+CDR

100Gbps

AOC & 100G SR4
3.3

4

600

Die & 2.75mm x 2.37mm