With the rapid promotion and popularization of emerging technologies such as cloud computing, the Internet of Things, artificial intelligence, and 5G, the human society in the future will evolve into a society in which all things perceive, all things are interconnected, and all things are intelligent. Based on its own technical research and development strength and market application needs, minisilicon focuses on mid-to-high-end optical module electrical chip products, and provides mid-to-high-speed, self-developed electrical chips for multiple high-growth application industries (PON/ 5G/data center) terminal products to meet the market demand of large bandwidth, low latency, wide connection, high security, better stability and high efficiency.

4G/5G Network
4G/5G Network
Datacenter
Datacenter
FTTx-PON
FTTx-PON

PN

Type

DataRate

Application

Supply

Voltage(V)

Channels

Power Consumption(mW)

Package&Size

VCSEL Driver+CDR

100Gbps

AOC & 100G SR4
3.3

4

700

Die & 2.75mm x 2.60mm

TIA+CDR

25Gbps

AOC & 25G SR
3.3

1

211

Die & 2750μm x 939μm

VCSEL Driver+CDR

25Gbps

AOC & 25G SR
3.3

1

236

Die & 2750μm x 982μm

VCSEL Driver+CDR+TIA

25Gbps

AOC & 25G SR
3.3

1

400

Die & 2750μm x 1570μm

10G EML Driver+LA

10Gbps

10G ER
3.3

1

750

QFN & 4mm x 4mm 

TIA

1.25~10Gbps

10G ONU
3.3

1

89.1

Die & 1080μm x 770μm

10G EML Driver+CDR+BM LA

10Gbps

XGSPON OLT
3.3

1

750

QFN & 4mm x 4mm 

10G EML Driver+CDR

10Gbps

XGSPON OLT
3.3

1

750

QFN & 4mm x 4mm 

BM LA

1.25&2.5&10Gbps

XGSPON OLT
3.3

1

303.6

QFN & 4mm x 4mm 

BM TIA

2.5&10.3125Gbps

XGSPON OLT
3.3

1

141.9

Die & 1080μm x 770μm