CN /
EN
News
Connect Today and the Future: minisilicons high bandwidth products appear at 2021 CIOE
Booth information:
Exhibition name: China International Optoelectronic Expo (CIOE)
Exhibition time: September 16-18, 2021
Exhibition location: Shenzhen International Convention and Exhibition Center (Baoan New Hall)
Booth number: 6B015-6B016
Related Recommendations
Notice on Relocation of minisilicon Chengdu
Hengxin Huaye's strategic investment in minisilicon helped it become the leader of high-speed digital analog hybrid chips in China
Connect Toady and the Future： minisilicon Make Its Public Appearance
