Hengxin Huaye's strategic investment in minisilicon helped it become the leader of high-speed digital analog hybrid chips in China

Release date:
2021-11-30
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Recently, Hengxin Huaye's strategic investment in minisilicon helped it become the leader of high-speed digital analog hybrid chips in China. This time, minisilicon successfully completed the ten million dollar financing. The institutions participating in this round of investment include AVIC investment, Dingqing investment and important industrial capital. minisilicon's products have been recognized by downstream customers, building a domestic leading position in the field of high-speed optical communication.

Founded in 2017 and headquartered in Shanghai, Shanghai minisilicon is a wholly-owned subsidiary of Hangzhou minisilicon. It is a high-tech chip R & D company dominated by R & D and integrating development, sales and service. minisilicon team is a mature returnee high-tech talent team, which originates from Silicon Valley and has more than 20 years of experience in commercial, optical communication, clock and digital analog hybrid integrated circuit chips. Its technical expertise includes the development and application of optical communication module chip design, high-speed transceiver, high-performance low-noise frequency synthesizer and high-speed SerDes phy.


   After its rapid development, optical module solutions and clock data distribution chips suitable for FTTx 10G PON OLT, 5G, Datacenter and other applications have been developed. The products have been verified by well-known optical module manufacturers in the industry and used for mass production.


PON Access Network

   PON access network is one of the most important application scenarios of optical communication. As a key core component, electrical chip is a key factor in the performance development and evolution of PON equipment and modules. minisilicon is the first full line research and development manufacturer of OLT in China, covering the application field of XGPON XGSPON. Domestic and foreign operators are deploying 10G PON on a large scale, cooperating with 5G construction to build a 'double Gigabit' network, so as to provide customers with a variety of high-performance voice, video and data services. Rice core uses reliable closed-loop technology to realize real-time laser monitoring and compensation, so as to reduce the production test demand and reduce the system cost.


   In order to meet the different application needs of PON market,  minisilicon has launched separate and combined chip solutions for customers to choose flexibly.


  Separation scheme: 10G CDR + EML DRV; 10G / 2.5G BM LA and 10G / 2.5G TIA have high degrees of freedom, and customers can adapt more flexible schemes according to their needs.


  Consolidation scheme: 10G CDR + EML DRV + 10G / 2.5G BM LA and 10G / 2.5G BM TIA, which can effectively save the internal space and packaging cost of the module.


   The working range of 10G CDR + EML DRV is 9.8Gb/s to 10.3Gb/s, the typical power consumption is 750mW, energy saving and environmental protection. TX parameters are highly configurable. Rich ADC resources are integrated internally to fully meet DDMI requirements; TIA simulates AGC with high stability. Low noise figure to achieve high sensitivity and anti-interference performance; The signal detection threshold range of La is wide, the CML output data noise is small, and the SD detection response time is short.


Datacenter


  In the Datacenter market, enterprises and service providers continue to deploy higher rate network ports to meet their rapidly growing network capacity requirements. 100G and 200G applications are an important part of data centers at home and abroad.


   minisilicon can provide advanced 100G short-range and 200G 10km data center electric chip solutions, and continuously invest resources to improve the existing product architecture and provide constant help for the optimization of customer data centers. At present, the products available include 4 × 25G TIA+CDR; 4× 25G CDR + VCSEL DRV and 4 × 50G PAM4 TIA。


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