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Notice on Relocation of minisilicon Chengdu
Dear customers: From December 31, 2021, Chengdu minisilicon will move to a new office address - 508, building 5, Tianfu New Valley, No. 399 Fucheng Avenue, Wuhou District, Chengdu.
Hengxin Huaye's strategic investment in minisilicon helped it become the leader of high-speed digital analog hybrid chips in China
Hengxin Huaye strategically invested in Shanghai minisilicon to help it complete ten million dollar financing. AVIC investment, Dingqing investment and other industrial capital participated in the investment. Hangzhou Mision technology, a wholly-owned subsidiary of Shanghai minisilicon, focuses on the development and application of optical communication module chip design, high-speed transceiver, high-performance low-noise frequency synthesizer and high-speed SerDes PHY.
Connect Toady and the Future： minisilicon Make Its Public Appearance
Summary: CIOE is holding in Shenzhen International Convention and Exhibition Center from September 16 to 18, 2021. minisilicon will present its fist products at booth 6B015&6B016.
Connect Today and the Future: minisilicons high bandwidth products appear at 2021 CIOE
Booth information:
Exhibition name: China International Optoelectronic Expo (CIOE)
Exhibition time: September 16-18, 2021
Exhibition location: Shenzhen International Convention and Exhibition Center (Baoan New Hall)
Booth number: 6B015-6B016
Rising Star on 2020 CIOE: minisilicon shows off the high bandwidth portfolio products on PON and Datacenter application
ICC News September 9-11, 2020, during the CIOE China Optical Expo, the optical fiber communication industry chain gathered together, and domestic and foreign manufacturers displayed their advanced products and solutions.